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Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V CC to GND..........................................................-0.3V to +5.5V
LO1, LO2 to GND .............................................................. Q 0.3V
LOSEL to GND ......................................... -0.3V to (V CC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ........................ +15dBm
RFMAIN, RFDIV Current (RF is DC shorted to GND
through a balun) .............................................................50mA
TAPMAIN, TAPDIV to GND .....................................-0.3V to +2V
Any Other Pins to GND ............................ -0.3V to (V CC + 0.3V)
Continuous Power Dissipation (Note 1) ..............................8.7W
B JA (Notes 2, 3) ........................................................... +38 N C/W
B JC (Notes 1, 3) .............................................................7.4 N C/W
Operating Temperature Range (Note 4) ... T C = -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Note 1: Based on junction temperature T J = T C + ( B JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Note 2: Junction temperature T J = T A + ( B JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = 4.75V to 5.25V, no input AC signals. T C = -40 N C to +85 N C, R1 = R4 = 681 I ,
R2 = R5 = 1.82k I . Typical values are at V CC = 5.0V, T C = +25 N C, unless otherwise noted. All parameters are production tested.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Total supply current
4.75
5
337
5.25
400
V
mA
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
LOSEL Input Current
I IH and I IL
-10
+10
F A
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = 3.0V to 3.6V, no input AC signals. T C = -40 N C to +85 N C, R1 = R4 = 681 I , R2 = R5 = 1.43k I .
Typical values are at V CC = 3.3V, T C = +25 N C, unless otherwise noted. Parameters are guaranteed by design and not production
tested.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
Total supply current (Note 5)
MIN
3.0
TYP
3.3
275
MAX
3.6
UNITS
V
mA
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
2
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